Would it be possible to make it watertight? It would be awesome if there was no need for an enclosure.
Similar to VESC6.
I use thermal tape on the FETs which does that job and stop them with shorting with anything else.
I donāt see any problem with cap and diode being there, parts donāt move and there is thermal tape in between.
FETs and solder - 0.7mm Thermal tape on top 0.3mm
Can I already order PCBs from you?
very good thanks!
Not sure why you want this but https://multimedia.3m.com/mws/media/122119O/3m-thermally-conductive-adhesive-transfer-tapes-8800-series.pdf
The new cover PCB arrived today, it might need some changes depending on the housingā¦
Hereās a pic of the case prototype I milled for science.
I would need to change the clamping in the machine to fit the corners of the cover. For the prototype I just rounded them to fit my system and moved the holes in 5mm.
Please @stewii make a video of your board running your VESC.
I know this is too much but if you could make a video of the VESC running on inclines and surpassing the 60k limit without frying the DRV, I and everyone i here would be pretty excited
Iāve got PCBs on the way, will try it on my 6374s but ultimately going to my carvon v4xl build in Januaryš
Whatās awesome is I only need a handful of new components on top of 4.12 bom, and I have all the upgraded caps already too
Hi stewii, please may I buy a PCB off you and the stencil files? Iād like to reflow up your board and have most of the components already from VESC4. Iām UK based. How can I PM you?
to PM, click on his username and then click āMessageā.
I dont think he will be able as he is new user lvl
You got PM
Canāt wait to see some reviews / videos!
Whatās the benefits of an enclosure vs an actual heat sink?
easier to machine, cheaper in small volumes. Donāt need a big finned heatsink unless youāre running high continuous loads. For Esk8 applications, itās just not needed.