Axle vesc thread

will you put the better fets on?

Yeah these are going to have IRF7749L1TRPBF DirectFets

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How are you going to put a heatsink on these?

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Right now, we’re in the process of designing heat sinks that’ll screw into the mounting holes near the logo on both sides.

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My brother and one of my friends are now looking into making boards and I have already recommended that they get your vescs. When will the new ones be ready?!

That diode and th capacitor will give you a lot of grief with the heatsink.

Shouldn’t have remove the mask near the edge of the fets, high risk of shorting the source-drain.

Putting them together right now! After testing them (until they break), we’ll start scaling up.

@Blasto The heat sink won’t touch those. Also noticed the mask and a few other mistakes made after ordering the PCB’s. Funny how you triple check everything and still find a mistake :rage:. These aren’t final production samples.

Like silk on copper :wink:

Just a few updates on some things here at Axle:

1. Now offering free shipping!: Partnering up with USPS gave us the opportunity to offer free shipping on all VESC orders. Just choose “Free Shipping” during Checkout!

2 Full Paypal Integration: We’ve been using Paypal buttons on our product pages for people to use since our E commerce system did not support it. As of now, Paypal is fully integrated with checkout, making it easier for customers to retrieve their order information and place their order on Paypal.

3 Free connectors: We now offer any common connectors on our VESC’s for free, making it easier to plan your build.

If you still need any “special types” of connectors, email us at [email protected]

goaxle.com

Have a great weekend guys!

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It’s been great watching u guys grow!!!

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Slowly but surely :slight_smile:

not to start a war but to compare ur components to companies like enertion, diy, and ollin what diferrentiates ur vesc. Liek ur 4.12 version against the vesc-x

It is in the first post…

“-Caps. at C37 and C51 and C18 have been upgraded to a higher capacitance to handle more powaa”

Vesc X essentially has higher current output because of direct fets. Zenon is working on direct fet vesc as well.

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Must have Skipped over it, thanks!!!

nearly got it :wink:

some more details below


UPGRADED DIRECTFET PACKAGE

  1. New form factor places all fets on one side allowing improved thermal management design.
  2. The metal package of the fets allows a better heat transfer and increases the current carrying capacities.
  3. Precision CNC aluminum heatsink will be used to improve thermal dynamics keeping the board much cooler preventing shutdowns caused by overheating
  4. Lower gate charge which will make it easier for the DRV8302. Faster switching time and reduced load on the mosfet driver.
  5. Compact footprint keeping the high current paths as short as possible for improved efficiency.

UPGRADED BOM COMPONENTS

  1. Some components in the original VESC BOM have been identified as a potential weakness that may lead to premature failures, components have been replace with higher tolerances.
  2. Increased number of ceramic decoupling capacitors for improved reliability.
  3. Large TVS diode capable of handling large voltage and current spikes, giving regenerative breaking an alternative current path when the battery is fully charged.
  4. Micro USB port to improve compatibility with the more common cables used with mobile phones. Easily accessible keeping all wires streamline.
  5. Low ESR bulk capacitors, giving you power when it’s needed most.

NEW FORM FACTOR

  1. The new form factor drastically improves the manufacturability of the VESC, the VESC-X is faster & easier to produce with reduced chance of manufacturing faults.
  2. The new layout keeps the logic & power separate, meaning traces are shorter and both ceramic and electrolytic capacitors are closer offering a more robust & reliable power system.
  3. Integrated Bulk Capacitors, inside the hard case, help prevent accidental shorts occurring & make the footprint more manageable in tight enclosures.
  4. This new PCB design with more accessible mounting holes makes installing a heatsink & hard case simple.
  5. Place holder M3 holes for adding another heatsink for even more cooling power.

NEW HARD CASE & HEATSINK INCLUDED

  1. A precision CNC aluminum heat sink not only improves the thermal properties of the vesc by dissipating the heat away from the board, it also protects from accidental shorts, accidental damage of vital components and provides a user-friendly mounting solution so you can install the vesc securely inside your components housing using common M3 screws.
  2. The top side of the new VESC-X hard case is made from super strong impact resistance ABS material, The top shell is non-conductive material and covers all the exposed areas making it nearly impossible to short out your VESC accidently.
  3. The impact resistant ABS shell design offers easy access to the various ports and has a window for monitoring the LED’s which is useful for diagnostics.
  4. With the built to last Aluminium Heatsink & Impact resistant tough case the VESC-X will be protected from accidental damage, whilst offering superior cooling performance during peak load draw.
  5. Compact footprint of the VESC-X allows two of them to be mounted side by side and keep all your wires nice and tidy to offer the cleanest builds out there, while still having access to all the ports.
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Great progress Zmoney!

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When someone orders right now, are the new upgrades already on board? DirectFets? Heatsink and things you mentioned above?

Nope. We’re running into some issues with the new VESC but we’re hoping those issues will be resolved within a week or two. It be have its own product page.

Alrightyoh! Keep us updated :slight_smile:

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Any news you can share?