Would it be possible to make it watertight? It would be awesome if there was no need for an enclosure.
Similar to VESC6.
I use thermal tape on the FETs which does that job and stop them with shorting with anything else.
I don’t see any problem with cap and diode being there, parts don’t move and there is thermal tape in between.
FETs and solder - 0.7mm Thermal tape on top 0.3mm
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Can I already order PCBs from you? 
very good thanks!
Not sure why you want this but https://multimedia.3m.com/mws/media/122119O/3m-thermally-conductive-adhesive-transfer-tapes-8800-series.pdf
The new cover PCB arrived today, it might need some changes depending on the housing…
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Here’s a pic of the case prototype I milled for science.
I would need to change the clamping in the machine to fit the corners of the cover. For the prototype I just rounded them to fit my system and moved the holes in 5mm.
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Please @stewii make a video of your board running your VESC.
I know this is too much but if you could make a video of the VESC running on inclines and surpassing the 60k limit without frying the DRV, I and everyone i here would be pretty excited
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I’ve got PCBs on the way, will try it on my 6374s but ultimately going to my carvon v4xl build in January😋
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What’s awesome is I only need a handful of new components on top of 4.12 bom, and I have all the upgraded caps already too 
Hi stewii, please may I buy a PCB off you and the stencil files? I’d like to reflow up your board and have most of the components already from VESC4. I’m UK based. How can I PM you?
to PM, click on his username and then click ‘Message’.
I dont think he will be able as he is new user lvl
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You got PM
Can’t wait to see some reviews / videos!
What’s the benefits of an enclosure vs an actual heat sink?
easier to machine, cheaper in small volumes. Don’t need a big finned heatsink unless you’re running high continuous loads. For Esk8 applications, it’s just not needed.
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